ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,614, issued on July 28. "Method and apparatus for plating metal and metal oxide layer cores" was invented by John Othniel McDonald (Reno, N... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,615, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Home appliance including hairline and manufa... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,616, issued on July 28, was assigned to TOYO KOHAN Co. LTD. (Tokyo). "Roughened plated sheet" was invented by Hiroki Yanaga (Kudamatsu, Jap... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,617, issued on July 28, was assigned to EBARA Corp. (Tokyo). "Plating apparatus and plating method" was invented by Yusui Goto (Tokyo), Kaz... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,618, issued on July 28, was assigned to EBARA Corp. (Tokyo). "Substrate holder, apparatus for plating, method of plating and storage medium... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,619, issued on July 28, was assigned to KWANSEI GAKUIN EDUCATIONAL FOUNDATION (Hyogo, Japan), TOYO ALUMINIUM K.K. (Osaka, Japan) and TOYOTA ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,620, issued on July 28, was assigned to HERMES-EPITEK CORP. (Taipei City, Taiwan). "Apparatus for producing silicon carbide crystal" was in... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,621, issued on July 28, was assigned to SILTRONIC AG (Munich). "Method for depositing an epitaxial layer on a substrate wafer made of semic... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,622, issued on July 28, was assigned to Hon Young Semiconductor Corp. (Hsinchu City, Taiwan). "Semiconductor structure and manufacturing me... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,623, issued on July 28, was assigned to Kokusai Electric Corp. (Tokyo). "Method of processing substrate, method of manufacturing semiconduc... Read More