US Patent Issued to EBARA on July 28 for "Plating apparatus and plating method" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,617, issued on July 28, was assigned to EBARA Corp. (Tokyo).

"Plating apparatus and plating method" was invented by Yusui Goto (Tokyo), Kazuhito Tsuji (Tokyo) and Mizuki Nagai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a plating apparatus and the like capable of improving the uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder for holding a substrate, an anode holder disposed in the plating tank to face the substrate held in the substrate holder, the anode holder being configured to hold a soluble anode, an anode mask attached to the anode holder, the anode mas...