ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,389, issued on July 28, was assigned to NXP USA INC. (Austin, Texas). "Reusable modular substrate" was invented by Kabir Mirpuri (Scottsdal... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,390, issued on July 28, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package comprising same"... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,391, issued on July 28, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring board" was invented by Takashi Nishiya... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,392, issued on July 28, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Toshiki Furutani (Ogaki, Japan),... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,393, issued on July 28, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China). "Circuit board assembly, manufacturing method, and electro... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,394, issued on July 28, was assigned to TOPPAN HOLDINGS INC. (Tokyo). "Wiring substrate" was invented by Yuki Umemura (Tokyo), Takehisa Tak... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,395, issued on July 28, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Kyung-Mok Lee (... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,396, issued on July 28, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Real-time control of via stub drilling depth... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,397, issued on July 28, was assigned to FUJI Corp. (Chiryu, Japan). "Circuit-forming method and circuit-forming apparatus" was invented by ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,398, issued on July 28, was assigned to Ciena Corp. (Hanover, Md.). "Method for placing a chip for device manufacturing" was invented by Ra... Read More