US Patent Issued to FUJI on July 28 for "Circuit-forming method and circuit-forming apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,397, issued on July 28, was assigned to FUJI Corp. (Chiryu, Japan).

"Circuit-forming method and circuit-forming apparatus" was invented by Kenji Tsukada (Toyota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit-forming method includes a first forming step of forming a resin layer including a recessed portion by a first discharge device configured to discharge a curable resin, and a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to a first mark formed by the first discharge device. A circuit-forming apparatus includes...