US Patent Issued to TOPPAN HOLDINGS on July 28 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,394, issued on July 28, was assigned to TOPPAN HOLDINGS INC. (Tokyo).

"Wiring substrate" was invented by Yuki Umemura (Tokyo), Takehisa Takada (Tokyo) and Tomoyuki Ishii (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component (capacitor) of the high-frequency circuit provided on a first surface of the glass substrate, and the bottom of the through hole in the glass substrate on the first surface have an overlapping part on the first surface. As a result, the capacitor is formed directly above the via, that is, the through hole, thereby eliminating the need for conductive wiring from the via to the capacitor. In addition, by forming a capac...