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US Patent Issued to Nuvoton Technology Corporation Japan on July 28 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,482, issued on July 28, was assigned to Nuvoton Technology Corporation Japan (Kyoto, Japan). "Semiconductor device" was invented by Ryou Ka... Read More


US Patent Issued to Micron Technology on July 28 for "Integrated assemblies and methods of forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,483, issued on July 28, was assigned to Micron Technology Inc. (Boise, Idaho). "Integrated assemblies and methods of forming integrated ass... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on July 28 for "Back-end-of-line vertical-transport transistor" (California, New York Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,484, issued on July 28, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Back-end-of-line vertical-transport transist... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,485, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Sunjun... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Integrated circuit device" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,486, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit device" was invented by H... Read More


US Patent Issued to Intel on July 28 for "Selectively thinned gate-all-around (GAA) structures" (Oregon Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,487, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Selectively thinned gate-all-around (GAA) structures" was inven... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,488, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structure ... Read More


US Patent Issued to Semiconductor Energy Laboratory on July 28 for "Semiconductor device comprising contact hole reaching semiconductor layer" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,489, issued on July 28, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Atsugi, Japan). "Semiconductor device comprising contact ... Read More


US Patent Issued to BOE Technology Group on July 28 for "Semiconductor substrate manufacturing method and semiconductor substrate" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,490, issued on July 28, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Semiconductor substrate manufacturing method and semicond... Read More


US Patent Issued to LG Display on July 28 for "Thin film transistor array substrate including oxide semiconductor pattern and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,491, issued on July 28, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Thin film transistor array substrate including oxide sem... Read More