ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,434, issued on July 28, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Module" was invented by Yoshihito Otsubo (Nagaoka... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,435, issued on July 28, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Data-analysis-based feedback of component po... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,436, issued on July 28, was assigned to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (Beijing). "Three-dimensional static ran... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,437, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices having contact plugs" ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,438, issued on July 28, was assigned to Micron Technology Inc. (Boise, Idaho). "Support structure for multiple, alternating epitaxial silic... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,439, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including an insulating... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,440, issued on July 28, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Semiconductor structure and method of manufactu... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,441, issued on July 28, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure" was invented by Kai Je... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,442, issued on July 28, was assigned to BEIJING SUPERSTRIG ACADEMY OF MEMORY TECHNOLOGY (Beijing). "Memory, and method for manufacturing me... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,443, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure and preparation met... Read More