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US Patent Issued to Intel on April 14 for "Integration of glass core into electronic substrates for fine pitch die tiling" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... और पढ़ें


US Patent Issued to FORMITEK ELECTRIC (ZHOUSHAN) on April 14 for "Switching power device and parallel connection structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... और पढ़ें


US Patent Issued to FORMITEK ELECTRIC (ZHOUSHAN) on April 14 for "Switching power device and parallel connection structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... और पढ़ें


US Patent Issued to Renesas Electronics on April 14 for "Method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by... और पढ़ें


US Patent Issued to Renesas Electronics on April 14 for "Method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by... और पढ़ें


US Patent Issued to Intel on April 14 for "Opossum redistribution frame for configurable memory devices" (Malaysian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,747, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Opossum redistribution frame for configurable memory devices"... और पढ़ें


US Patent Issued to Intel on April 14 for "Opossum redistribution frame for configurable memory devices" (Malaysian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,747, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Opossum redistribution frame for configurable memory devices"... और पढ़ें


US Patent Issued to Intel on April 14 for "Capacitor pads and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... और पढ़ें


US Patent Issued to Intel on April 14 for "Capacitor pads and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,749, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyu... और पढ़ें