US Patent Issued to Intel on April 14 for "Integration of glass core into electronic substrates for fine pitch die tiling" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integration of glass core into electronic substrates for fine pitch die tiling" was invented by Jeremy D. Ecton (Gilbert, Ariz.), Brandon C. Marin (Gilbert, Ariz.), Aleksandar Aleksov (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.) and Leonel Arana (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core with a first surface and a second surface, where the core comprises glass. In an embodiment, a first via is through the core, where the first via ...