US Patent Issued to Renesas Electronics on April 14 for "Method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo).

"Method of manufacturing semiconductor device" was invented by Kosuke Kitaichi (Tokyo), Masatoshi Sugiura (Tokyo), Hideaki Tamimoto (Tokyo), Takehiko Maeda (Tokyo), Keita Takada (Tokyo) and Yoshitaka Kyougoku (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "To manufacture a semiconductor device, a first heat treatment for curing a first adhesive material of a conductive paste type is performed, after a semiconductor chip is mounted on a die pad of a lead frame via the first adhesive material. After that, a metal plate is disposed on a pad of the semiconductor chip such...