ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,416, issued on July 21, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method" was invented by Tomohiro Tak... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,417, issued on July 21, was assigned to NGK INSULATORS Ltd. (Nagoya-City, Japan). "Wafer placement table" was invented by Seiya Inoue (Hand... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,418, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Apparatus for clamping a substrate on a mono-polar e... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,419, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Forming mesas on an electrostatic chuck" was invente... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,420, issued on July 21, was assigned to Tokyo Ohka Kogyo Co. Ltd. (Kawasaki, Japan). "Semiconductor device production method" was invented ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,421, issued on July 21, was assigned to Persimmon Technologies Corp. (Wakefield, Mass.). "Material-handling robot trajectory control" was i... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,422, issued on July 21, was assigned to GLOBALWAFERS Co. LTD. (Hsinchu City, Taiwan). "Wafer carrier" was invented by Chih-Yuan Chuang (Hsi... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,423, issued on July 21, was assigned to ERS ELECTRONIC GMBH (Germering, Germany). "Shielding device for a chuck, corresponding chuck, and c... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,424, issued on July 21, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Lift pin assembly and substrate processing apparatus hav... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,425, issued on July 21, was assigned to PROTEANTECS LTD. (Haifa, Israel). "Die-to-die connectivity monitoring with a clocked receiver" was ... Read More