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US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "One-time-programmable memory devices and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,191, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "One-time-programmable memory device... Read More


US Patent Issued on July 21 for "Integrated assemblies having conductive posts extending through stacks of alternating materials" (Idaho Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,192, issued on July 21. "Integrated assemblies having conductive posts extending through stacks of alternating materials" was invented by S... Read More


US Patent Issued to SK hynix on July 21 for "Semiconductor device and manufacturing method of semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,193, issued on July 21, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and manufacturing method of semicon... Read More


US Patent Issued to Lodestar Licensing Group on July 21 for "Microelectronic devices including staircase structures, and related memory devices" (Idaho Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,194, issued on July 21, was assigned to Lodestar Licensing Group LLC (Evanston, Ill.). "Microelectronic devices including staircase structu... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,195, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Daewon... Read More


US Patent Issued to CANON ANELVA on July 21 for "Stacked structure, memory device and method of manufacturing stacked structure" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,196, issued on July 21, was assigned to CANON ANELVA Corp. (Kawasaki, Japan). "Stacked structure, memory device and method of manufacturing... Read More


US Patent Issued to Ferroelectric Memory on July 21 for "Memory cell, memory device, and methods thereof" (German Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,197, issued on July 21, was assigned to Ferroelectric Memory GmbH (Dresden, Germany). "Memory cell, memory device, and methods thereof" was... Read More


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Semiconductor device structure" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,198, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure" was invented by ... Read More


US Patent Issued to Eagle Technology on July 21 for "Method of fabricating high accuracy embedded resistors in flex substrates" (Florida, Virginia Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,199, issued on July 21, was assigned to Eagle Technology LLC (Melbourne, Fla.). "Method of fabricating high accuracy embedded resistors in ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Integrated circuit device" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,200, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Integrated circuit device" was invented b... Read More