US Patent Issued on July 21 for "Integrated assemblies having conductive posts extending through stacks of alternating materials" (Idaho Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,192, issued on July 21.

"Integrated assemblies having conductive posts extending through stacks of alternating materials" was invented by Shuangqiang Luo (Boise, Idaho), Indra V. Chary (Boise, Idaho), Justin B. Dorhout (Boise, Idaho) and Rita J. Klein (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a conductive expanse over conductive nodes. The conductive nodes include a first composition. A bottom surface of the conductive expanse includes a second composition which is different composition than the first composition. A stack is over the conductive expanse. The stack includes alte...