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US Patent Issued on Sept. 8 for "Method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,532, issued on Sept. 8. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo), S... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Integrated circuit package and method of forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,533, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit package and meth... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,534, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and manufac... Read More


US Patent Issued to Amkor Technology Singapore Holding on Sept. 8 for "Electronic devices having embedded module and methods of manufacturing electronic devices having the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,535, issued on Sept. 8, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices having embedded modul... Read More


US Patent Issued to DENSO on Sept. 8 for "Element package and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,536, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan). "Element package and semiconductor device" was invented by Yoshih... Read More


US Patent Issued to NXP USA on Sept. 8 for "Two-part molding of device packages with spacers" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,537, issued on Sept. 8, was assigned to NXP USA INC. (Austin, Texas). "Two-part molding of device packages with spacers" was invented by An... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Die stacking structure, semiconductor package and manufacturing method of the die stacking structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,538, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Die stacking structure, semiconduct... Read More


US Patent Issued to MITSUBISHI ELECTRIC on Sept. 8 for "Semiconductor device and power converter" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,539, issued on Sept. 8, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor device and power converter" was invented by Kohei... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Integrated circuit packages, devices using the same, and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,540, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages, device... Read More


US Patent Issued to Samsung Display on Sept. 8 for "Display device and method for manufacturing display device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,541, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method for manufacturing dis... Read More