ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,754, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with non-uniform interconnect features" wa... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,754, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with non-uniform interconnect features" wa... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,755, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device interconnects formed through volumet... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,755, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device interconnects formed through volumet... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,756, issued on April 14. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo),... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,756, issued on April 14. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo),... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,757, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor package" was invented by Bo ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,757, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor package" was invented by Bo ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... और पढ़ें