ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,515, issued on Sept. 1, was assigned to Micron Technology Inc. (Boise, Idaho). "Stacked semiconductor die assemblies with support members a... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,516, issued on Sept. 1, was assigned to Micron Technology Inc. (Boise, Idaho). "Integrated circuits with selectable packaging types" was in... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,517, issued on Sept. 1, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan). "Chip package structure and manufacturing method... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,518, issued on Sept. 1, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Atsugi, Japan). "Display device" was invented by Koji Kus... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,519, issued on Sept. 1, was assigned to CR Runan Technologies (Chongqing) Co. Ltd. (Chongqing, China). "Semiconductor package method and se... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,520, issued on Sept. 1, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Backlight and display system" was invented by Yuhs... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,521, issued on Sept. 1, was assigned to AP Memory Technology Corp. (Hsinchu County, Taiwan). "Semiconductor structure and manufacturing met... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,522, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of fabricating package struc... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,523, issued on Sept. 1, was assigned to Intel Corp. (Santa Clara, Calif.). "Varied ball ball-grid-array (BGA) packages" was invented by Xia... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,524, issued on Sept. 1, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor apparatus and semiconductor apparatus manu... Read More