US Patent Issued to CR Runan Technologies (Chongqing) on Sept. 1 for "Semiconductor package method and semiconductor package structure" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,519, issued on Sept. 1, was assigned to CR Runan Technologies (Chongqing) Co. Ltd. (Chongqing, China).

"Semiconductor package method and semiconductor package structure" was invented by Xufeng Tu (Chongqing, China) and Yan Huo (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application provides a semiconductor package method and a semiconductor package structure. The semiconductor package method includes: disposing a substrate layer on a front surface of a passive device, where the front surface of the passive device is provided with electrical connectors, the substrate layer is provided with substrate-layer openings that run t...