US Patent Issued to Micron Technology on Sept. 1 for "Stacked semiconductor die assemblies with support members and associated systems and methods" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,515, issued on Sept. 1, was assigned to Micron Technology Inc. (Boise, Idaho).

"Stacked semiconductor die assemblies with support members and associated systems and methods" was invented by Hong Wan Ng (Singapore) and Seng Kim Ye (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked semiconductor die assemblies with support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a plurality of support members also attached to the package substrate. The plurality of support members can ...