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US Patent Issued to Skyworks Solutions on Sept. 1 for "Electrical packages with elongated interconnect members" (Iowa, California Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,495, issued on Sept. 1, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Electrical packages with elongated interconnect members"... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package including a pad comprising a connection portion connecting a first and second pad portions" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,496, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package including a pad compri... Read More


US Patent Issued to Powerchip Semiconductor Manufacturing on Sept. 1 for "Memory tile with probe pad arrangement and stacked memory device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,497, issued on Sept. 1, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "Memory tile with probe pad arrangem... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,498, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of manuf... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Three-dimensional semiconductor package with package-on-package semiconductor chips" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,499, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional semiconductor package with... Read More


US Patent Issued to ACT IDENTITY TECHNOLOGY on Sept. 1 for "Chip module and method of forming same" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,500, issued on Sept. 1, was assigned to ACT IDENTITY TECHNOLOGY Ltd. (New Territories, Hong Kong). "Chip module and method of forming same"... Read More


US Patent Issued to FUJI ELECTRIC on Sept. 1 for "Bonding tool, semiconductor device manufacturing method, and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,501, issued on Sept. 1, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Bonding tool, semiconductor device manufacturing method,... Read More


US Patent Issued to STATS ChipPAC on Sept. 1 for "Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,502, issued on Sept. 1, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of using a standardized carri... Read More


US Patent Issued to Kulicke and Soffa Industries on Sept. 1 for "Wire guides, wire bonding systems, and related methods" (California, Texas Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,503, issued on Sept. 1, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Wire guides, wire bonding systems, and r... Read More


US Patent Issued to WIN SEMICONDUCTORS on Sept. 1 for "Semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,504, issued on Sept. 1, was assigned to WIN SEMICONDUCTORS CORP. (Taoyuan City, Taiwan). "Semiconductor structure" was invented by Shao-Yu ... Read More