US Patent Issued to ACT IDENTITY TECHNOLOGY on Sept. 1 for "Chip module and method of forming same" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,500, issued on Sept. 1, was assigned to ACT IDENTITY TECHNOLOGY Ltd. (New Territories, Hong Kong).

"Chip module and method of forming same" was invented by Gang Chen (Kwai Chung, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip module (40a, 40b, 62) is disclosed as including an integrated-circuit (IC) chip (34, 64), a first flexible substrate layer (18) with a number of holes (28), a second adhesive substrate layer (16) with a number of holes (26), and a third substrate layer (14) made of an electrically conductive material, the second substrate layer being sandwiched between and fixedly engaged with the first and third substrate laye...