US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Three-dimensional semiconductor memory device with dummy plug and electronic system including the same" (South Korean Inventors)

Posted On: 2026-09-01

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,174, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Three-dimensional semiconductor memory devic... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package and method of manufacturing the same" (South Korean Inventor)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,175, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More

US Patent Issued to Yangtze Memory Technologies on Sept. 1 for "Three-dimensional memory devices and manufacturing methods thereof and three-dimensional memories" (Chinese Inventor)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,176, issued on Sept. 1, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Three-dimensional memory devices and manufact... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 1 for "Package with integrated voltage regulator and method forming the same" (Taiwanese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,177, issued on Sept. 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Package with integrated voltage reg... Read More

US Patent Issued to DIODES on Sept. 1 for "Semiconductor rectifier" (Taiwanese, British, Chinese, American Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,178, issued on Sept. 1, was assigned to DIODES Inc. (Plano, Texas). "Semiconductor rectifier" was invented by Tao Long (Shanghai), Ze Rui C... Read More

US Patent Issued to International Business Machines on Sept. 1 for "Trench capacitor in backside diffusion break" (New York Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,179, issued on Sept. 1, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Trench capacitor in backside diffusion break... Read More

US Patent Issued to SAMSUNG ELECTRONICS, Pusan National University Industry-University Cooperation on Sept. 1 for "Semiconductor device" (South Korean Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,180, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. and Pusan National University Industry-University Cooperation. "Semico... Read More

US Patent Issued to The 13th Research Institute of China Electronics Technology Group on Sept. 1 for "Method for preparing Schottky diode and Schottky diode" (Chinese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,181, issued on Sept. 1, was assigned to The 13th Research Institute of China Electronics Technology Group Corp. (Shijiazhuang, China). "Met... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Electrostatic discharge circuitry for a high-voltage semiconductor device" (Taiwanese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,182, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Electrostatic discharge circuitry f... Read More

US Patent Issued to Renesas Electronics on Sept. 1 for "Method of manufacturing semiconductor device" (Japanese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,183, issued on Sept. 1, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by T... Read More

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US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Three-dimensional semiconductor memory device with dummy plug and electronic system including the same" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package and method of manufacturing the same" (South Korean Inventor)

US Patent Issued to Yangtze Memory Technologies on Sept. 1 for "Three-dimensional memory devices and manufacturing methods thereof and three-dimensional memories" (Chinese Inventor)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 1 for "Package with integrated voltage regulator and method forming the same" (Taiwanese Inventors)

US Patent Issued to DIODES on Sept. 1 for "Semiconductor rectifier" (Taiwanese, British, Chinese, American Inventors)

US Patent Issued to International Business Machines on Sept. 1 for "Trench capacitor in backside diffusion break" (New York Inventors)

US Patent Issued to SAMSUNG ELECTRONICS, Pusan National University Industry-University Cooperation on Sept. 1 for "Semiconductor device" (South Korean Inventors)

US Patent Issued to The 13th Research Institute of China Electronics Technology Group on Sept. 1 for "Method for preparing Schottky diode and Schottky diode" (Chinese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Electrostatic discharge circuitry for a high-voltage semiconductor device" (Taiwanese Inventors)

US Patent Issued to Renesas Electronics on Sept. 1 for "Method of manufacturing semiconductor device" (Japanese Inventors)