US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package including heat dissipation structure" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,043, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including heat dissipati... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package having metal line spaced part from capacitor on second side of package substrate" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,044, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package having metal line spaced... Read More

US Patent Issued to Zhuhai YUEXIN Semiconductor on June 9 for "Packaging structure for realizing chip interconnection and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,045, issued on June 9, was assigned to Zhuhai YUEXIN Semiconductor LLC (Zhuhai, China). "Packaging structure for realizing chip interconnect... Read More

US Patent Issued to SANDISK TECHNOLOGIES on June 9 for "Semiconductor device package with die stackup and interposer" (California, Washington Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,046, issued on June 9, was assigned to SANDISK TECHNOLOGIES INC. (Milipitas, Canada). "Semiconductor device package with die stackup and int... Read More

US Patent Issued to Intel on June 9 for "Composite bridges for 3D stacked integrated circuit power delivery" (Malaysian Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,047, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.). "Composite bridges for 3D stacked integrated circuit power deliver... Read More

US Patent Issued to Avago Technologies International Sales on June 9 for "Double side molded land grid array package platform using a substrate with copper posts" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,048, issued on June 9, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Double side molded land grid array pac... Read More

US Patent Issued to SERIPHY TECHNOLOGY on June 9 for "Semiconductor structures and method for manufacturing a semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,049, issued on June 9, was assigned to SERIPHY TECHNOLOGY Corp. (Hsinchu County, Taiwan). "Semiconductor structures and method for manufactu... Read More

US Patent Issued to XILINX on June 9 for "Memory bandwidth through vertical connections" (Colorado, California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,050, issued on June 9, was assigned to XILINX INC. (San Jose, Calif.). "Memory bandwidth through vertical connections" was invented by Brian... Read More

US Patent Issued to Skyworks Solutions on June 9 for "Integrated device package with opening in carrier" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,051, issued on June 9, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Integrated device package with opening in carrier" was inv... Read More

US Patent Issued to AaltoSemi on June 9 for "Electronic package, package substrate and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,052, issued on June 9, was assigned to AaltoSemi Inc. (Nanjing City, China). "Electronic package, package substrate and manufacturing method... Read More

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