US Patent Issued to Skyworks Solutions on June 9 for "Integrated device package with opening in carrier" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,051, issued on June 9, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Integrated device package with opening in carrier" was invented by Takanori Yasuda (Nara, Japan), Siarhei Dmitrievich Barsukou (Takarazuka, Japan), Keiichi Maki (Suita, Japan) and Hiroyuki Nakamura (Osaka-Fu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device package is disclosed. The integrated device package can include a carrier that has an opening extending at least partially through a thickness of the carrier. The integrated device package can include a microelectronicmechanical systems die that is at least partially disposed in the opening a...