US Patent Issued to Intel on June 9 for "Composite bridges for 3D stacked integrated circuit power delivery" (Malaysian Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,047, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Composite bridges for 3D stacked integrated circuit power delivery" was invented by Bok Eng Cheah (Gelugor, Malaysia), Jenny Shio Yin Ong (Bayan Lepas, Malaysia), Jackson Chung Peng Kong (Tanjung Tokong, Malaysia) and Seok Ling Lim (Kulim Kedah, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to semiconductor packages incorporating composite or hybrid bridges that include first and second interconnect bridges positioned on a substrate and a power corridor with a plurality of vertical channels positioned on the substrate between the fi...