US Patent Issued to Kulicke and Soffa Industries on May 12 for "Methods of improving wire bonding operations" (Pennsylvania Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,683, issued on May 12, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Methods of improving wire bonding operatio... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,684, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jeonghy... Read More

US Patent Issued to NXP USA on May 12 for "Double-sided multichip packages with direct die-to-die coupling" (Arizona Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,685, issued on May 12, was assigned to NXP USA INC. (Austin, Texas). "Double-sided multichip packages with direct die-to-die coupling" was i... Read More

US Patent Issued to Intel on May 12 for "Techniques to enable a flip chip underfill exclusion zone" (Arizona, California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,686, issued on May 12, was assigned to Intel Corp. (Santa Clara, Calif.). "Techniques to enable a flip chip underfill exclusion zone" was in... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,687, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ma... Read More

US Patent Issued to Infineon Technologies on May 12 for "Power semiconductor module arrangement and housing for a power semiconductor module arrangement" (German Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,688, issued on May 12, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Power semiconductor module arrangement and housing fo... Read More

US Patent Issued to Applied Materials on May 12 for "Micro-LED displays to reduce subpixel crosstalk" (California, Oregon Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,689, issued on May 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Micro-LED displays to reduce subpixel crosstalk" was i... Read More

US Patent Issued to Micron Technology on May 12 for "Layouts of data pads on a semiconductor die" (Japanese, German Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,690, issued on May 12, was assigned to Micron Technology Inc. (Boise, Idaho). "Layouts of data pads on a semiconductor die" was invented by ... Read More

US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE TECHNOLOGY GROUP on May 12 for "Display substrate and display device" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,691, issued on May 12, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD. (Be... Read More

US Patent Issued to UNITED MICROELECTRONICS on May 12 for "Semiconductor package, semiconductor bonding structure, and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,692, issued on May 12, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor package, semiconductor bonding ... Read More

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