US Patent Issued to Intel on May 12 for "Techniques to enable a flip chip underfill exclusion zone" (Arizona, California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,686, issued on May 12, was assigned to Intel Corp. (Santa Clara, Calif.).

"Techniques to enable a flip chip underfill exclusion zone" was invented by Ronald Spreitzer (Phoenix), Jason Garcia (Scottsdale, Ariz.), Ankur Agrawal (Chandler, Ariz.), Eleanor Patricia Paras Rabadam (Folsom, Calif.) and Guiyun Bai (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Example techniques to enable a flip chip underfill exclusion zone include use of bump barriers, films or etched substrate cavities to prevent underfill from reaching the flip chip underfill exclusion zone."

The patent was filed on Dec. 23, 2021, under Application No. 17/561,432.

*For...