US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,687, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacturing the same" was invented by Kuan-Yu Huang (Taipei, Taiwan), Sung-Hui Huang (Yilan County, Taiwan), Shang-Yun Hou (Hsinchu, Taiwan) and Chien-Yuan Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first substrate, an electronic component, and a lid. The first substrate includes a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top si...