ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,258, issued on June 30, was assigned to SQ TECHNOLOGY (SHANGHAI) Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan). "Liquid level height... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,259, issued on June 30, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Multiphase pumped cooling system for data center thermal manag... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,260, issued on June 30, was assigned to 4MOTEC GMBH & CO KG (Graz, Austria). "Heat dissipation device" was invented by Gert Krammer (Graz, ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,261, issued on June 30, was assigned to Covestro Deutschland AG (Leverkusen, Germany). "Easily recyclable thermoplastic housing" was invent... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,262, issued on June 30, was assigned to SHT Smart High-Tech AB (Gothenburg, Sweden). "Laminated graphene-based thermally conductive film an... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,263, issued on June 30, was assigned to 1FINITY Inc. (Kawasaki, Japan). "Module mounting device and information processing apparatus" was i... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,264, issued on June 30. "Cooling system for electronic devices" was invented by Charles L'Ecuyer (Edmonton, Canada). According to the abst... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,265, issued on June 30, was assigned to DENSO Corp. (Kariya-city, Japan). "Electronic device" was invented by Kimihiro Matsuoka (Kariya Cit... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,266, issued on June 30, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Electronic control device" was invented by Minami Terani... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,267, issued on June 30, was assigned to Delta Electronics Inc. (Taoyuan City, Taiwan). "Power module assembly" was invented by Kaijian Yang... Read More