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US Patent Issued to SQ TECHNOLOGY (SHANGHAI), INVENTEC on June 30 for "Liquid level height detection mechanism and computing device" (Taiwanese, Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,258, issued on June 30, was assigned to SQ TECHNOLOGY (SHANGHAI) Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan). "Liquid level height... Read More


US Patent Issued to NVIDIA on June 30 for "Multiphase pumped cooling system for data center thermal management" (California, New York Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,259, issued on June 30, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Multiphase pumped cooling system for data center thermal manag... Read More


US Patent Issued to 4MOTEC on June 30 for "Heat dissipation device" (Austrian Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,260, issued on June 30, was assigned to 4MOTEC GMBH & CO KG (Graz, Austria). "Heat dissipation device" was invented by Gert Krammer (Graz, ... Read More


US Patent Issued to Covestro Deutschland on June 30 for "Easily recyclable thermoplastic housing" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,261, issued on June 30, was assigned to Covestro Deutschland AG (Leverkusen, Germany). "Easily recyclable thermoplastic housing" was invent... Read More


US Patent Issued to SHT Smart High-Tech on June 30 for "Laminated graphene-based thermally conductive film and pad and method for manufacturing the film and pad" (Swedish Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,262, issued on June 30, was assigned to SHT Smart High-Tech AB (Gothenburg, Sweden). "Laminated graphene-based thermally conductive film an... Read More


US Patent Issued to 1FINITY on June 30 for "Module mounting device and information processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,263, issued on June 30, was assigned to 1FINITY Inc. (Kawasaki, Japan). "Module mounting device and information processing apparatus" was i... Read More


US Patent Issued on June 30 for "Cooling system for electronic devices" (Canadian Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,264, issued on June 30. "Cooling system for electronic devices" was invented by Charles L'Ecuyer (Edmonton, Canada). According to the abst... Read More


US Patent Issued to DENSO on June 30 for "Electronic device" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,265, issued on June 30, was assigned to DENSO Corp. (Kariya-city, Japan). "Electronic device" was invented by Kimihiro Matsuoka (Kariya Cit... Read More


US Patent Issued to Hitachi Astemo on June 30 for "Electronic control device" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,266, issued on June 30, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Electronic control device" was invented by Minami Terani... Read More


US Patent Issued to Delta Electronics on June 30 for "Power module assembly" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,267, issued on June 30, was assigned to Delta Electronics Inc. (Taoyuan City, Taiwan). "Power module assembly" was invented by Kaijian Yang... Read More