ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,267, issued on June 30, was assigned to Delta Electronics Inc. (Taoyuan City, Taiwan).
"Power module assembly" was invented by Kaijian Yang (Shanghai), Shaojun Chen (Shanghai), Xi Liu (Shanghai) and Quansong Luo (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block include...