US Patent Issued to Hitachi Astemo on July 28 for "Power semiconductor device with cooler herein" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,764, issued on July 28, was assigned to Hitachi Astemo Ltd. (Ibaraki, Japan). "Power semiconductor device with cooler herein" was invented ... Read More

US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on July 28 for "Semiconductor device and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,765, issued on July 28, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. ... Read More

US Patent Issued to QING DING PRECISION ELECTRONICS (HUAIAN), Avary Holding (Shenzhen) Co. Ltd. on July 28 for "System-in-package module and method for manufacturing the same" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,766, issued on July 28, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. L... Read More

US Patent Issued to Sumitomo Electric Device Innovations on July 28 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,767, issued on July 28, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan). "Semiconductor device" was invented by... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Wafer bonding method and bonded device structure" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,768, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Wafer bonding method and bonded dev... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,769, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of fabricat... Read More

US Patent Issued to FUJI ELECTRIC on July 28 for "Semiconductor device and method for manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,770, issued on July 28, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device and method for manufacturing the sa... Read More

US Patent Issued to TEXAS INSTRUMENTS on July 28 for "Semiconductor package with flip chip solder joint capsules" (Philippine Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,771, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor package with flip chip solder joint capsules" was i... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on July 28 for "Chip package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,772, issued on July 28, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Chip package structure" was invented ... Read More

US Patent Issued to Amkor Technology Singapore Holding on July 28 for "Semiconductor devices and methods of manufacturing semiconductor devices" (South Korean, Japanese, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,773, issued on July 28, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices and methods of man... Read More

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