US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,769, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Hyun Su Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a substrate; a first semiconductor chip disposed on the substrate, wherein the first semiconductor chip includes first and second surfaces, which are opposite to each other, and has first and second trenches formed on the first surface thereof, wherein the first and second trenches extend in first and second directions, respectively, wherein the first and second directi...