ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,772, issued on July 28, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).
"Chip package structure" was invented by Yan-Wei Chen (Taipei City, Taiwan) and Chih-Jen Su (Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure includes a circuit substrate, a lead frame, a first chip, a second chip, a connecting member, and a package body. The lead frame is stacked on the circuit substrate, and the lead frame is bent to form an accommodating space. The first chip is disposed on the lead frame and located in the accommodating space. The second chip is disposed on the circuit substrate and loca...