US Patent Issued to Jabil on May 19 for "Bond pad connector for securing an electronic component thereon" (Malaysian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,074, issued on May 19, was assigned to Jabil Inc. (St. Petersburg, Fla.). "Bond pad connector for securing an electronic component thereon" ... Read More

US Patent Issued to Taiyo Yuden on May 19 for "Electronic component and manufacturing method of electronic component incorporated substrate" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,075, issued on May 19, was assigned to Taiyo Yuden Co. Ltd. (Tokyo). "Electronic component and manufacturing method of electronic component ... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on May 19 for "Printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,076, issued on May 19, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by S... Read More

US Patent Issued to LENOVO (BEIJING) on May 19 for "Flexible printed circuit and electronic device" (Chinese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,077, issued on May 19, was assigned to LENOVO (BEIJING) Ltd. (Beijing). "Flexible printed circuit and electronic device" was invented by Shu... Read More

US Patent Issued to Steering Solutions IP Holding on May 19 for "Non-symmetric single circuit board assembly with dielectric material" (Michigan Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,078, issued on May 19, was assigned to Steering Solutions IP Holding Corp. (Saginaw, Mich.). "Non-symmetric single circuit board assembly wi... Read More

US Patent Issued to Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO on May 19 for "Donor plate, deposition device and deposition method" (Dutch Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,079, issued on May 19, was assigned to Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO ('s-Gravenhage, Netherland... Read More

US Patent Issued to Sandisk Technologies on May 19 for "Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,080, issued on May 19, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Wire bonding machine having a rotatable capillary to s... Read More

US Patent Issued to Marvell Asia on May 19 for "Warpage-resilient attachment of die to substrate in mass reflow soldering" (California Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,081, issued on May 19, was assigned to Marvell Asia Pte Ltd (Singapore). "Warpage-resilient attachment of die to substrate in mass reflow so... Read More

US Patent Issued to MacDermid Enthone on May 19 for "Single step electrolytic method of filling through-holes in printed circuit boards and other substrates" (Chinese, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,082, issued on May 19, was assigned to MacDermid Enthone Inc. (Waterbury, Conn.). "Single step electrolytic method of filling through-holes ... Read More

US Patent Issued to Gigaphoton on May 19 for "Laser processing method and circuit board manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,083, issued on May 19, was assigned to Gigaphoton Inc. (Tochigi, Japan). "Laser processing method and circuit board manufacturing method" wa... Read More

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