US Patent Issued to MacDermid Enthone on May 19 for "Single step electrolytic method of filling through-holes in printed circuit boards and other substrates" (Chinese, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,082, issued on May 19, was assigned to MacDermid Enthone Inc. (Waterbury, Conn.).

"Single step electrolytic method of filling through-holes in printed circuit boards and other substrates" was invented by Donald Desalvo (Jiangsu Province, China), Ron Blake (Oxford, Conn.), Carmichael Gugliotti (Bristol, Conn.), William J. Decesare (Wolcott, Conn.) and Richard A. Bellemare (Watertown, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic subs...