ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,074, issued on May 19, was assigned to Jabil Inc. (St. Petersburg, Fla.).
"Bond pad connector for securing an electronic component thereon" was invented by Lun Hao Tung (Butterworth, Malaysia), Lai Ming Lim (Bukit Mertajam, Malaysia) and Zambri Samsudin (Gelugor, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive ...