US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,678, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Min... Read More

US Patent Issued to KYOCERA AVX Components on Sept. 22 for "Package-on-package assembly containing a decoupling capacitor" (California Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,679, issued on Sept. 22, was assigned to KYOCERA AVX Components Corp. (Fountain Inn, S.C.). "Package-on-package assembly containing a deco... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package with reduced adhesive fillets" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,680, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package with reduced adhe... Read More

US Patent Issued to Apple on Sept. 22 for "Chip singulation assisted structures and methods for improving bonding interface quality" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,681, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.). "Chip singulation assisted structures and methods for improving b... Read More

US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Sept. 22 for "Multi-chip high memory bandwidth configuration" (New York Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,683, issued on Sept. 22, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Multi-chip high memory bandwidth configura... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,684, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,685, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More

Usara (Golf Club Anuradhapura) wins Kandy Junior Golf Title

SriLanka, Sept. 24 -- Ten-year-old Usara Inupa Bandara Nugegoda won the boys' Copper Division title at the Prima Kandy Regional Junior Open Golf Championship 2026, leading a strong showing by Golf Clu... Read More

Apollo Tyres Debuts PV Testing Caravan With Advanced Balancing Capability

India, Sept. 24 -- Apollo Tyres Ltd has commissioned a new Passenger Vehicle Testing Caravan, a sophisticated mobile workshop engineered to move tyre assembly preparation directly to the test track. T... Read More

US Patent Issued to SFC on Sept. 22 for "Organoelectroluminescent device using polycyclic aromatic compounds" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,115, issued on Sept. 22, was assigned to SFC Co. LTD. (Cheongju-si, South Korea). "Organoelectroluminescent device using polycyclic aromat... Read More

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