US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Sept. 22 for "Multi-chip high memory bandwidth configuration" (New York Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,683, issued on Sept. 22, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Multi-chip high memory bandwidth configuration" was invented by Katsuyuki Sakuma (Fishkill, N.Y.), Mukta Ghate Farooq (Hopewell Junction, N.Y.) and Ramachandra Divakaruni (Ossining, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged device that carries multiple component devices uses a back-mounted structure to reduce the area of the substrates in the package. The package includes a first organic laminate substrate and a second organic laminate substrate. The first organic laminate substrate is the base substrate of the packaged device. The s...