US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package with reduced adhesive fillets" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,680, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package with reduced adhesive fillets" was invented by Jongpa Hong (Suwon-si, South Korea), Yeongkwon Ko (Suwon-si, South Korea), Gunho Chang (Suwon-si, South Korea), Wonkeun Kim (Suwon-si, South Korea) and Wonyoung Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base chip, a first semiconductor chip on the base chip, the first semiconductor chip including first through-vias, first bump structures on the first front surface of the first semiconductor chip, a plurality of second...