US Patent Issued to Intel on June 9 for "Semiconductor package with stacked memory devices" (Malaysian Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,065, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor package with stacked memory devices" was invented b... Read More

US Patent Issued to Xiamen PVTECH on June 9 for "Light-emitting diode with high reliability" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,066, issued on June 9, was assigned to Xiamen PVTECH Co. Ltd. (Xiamen, China). "Light-emitting diode with high reliability" was invented by ... Read More

US Patent Issued to Micron Technology on June 9 for "Memory array structures" (Idaho Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,067, issued on June 9, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory array structures" was invented by Shyam Surthi (Boise,... Read More

US Patent Issued to SHIN-ETSU CHEMICAL on June 9 for "Method for producing a light emitting diode supply substrate, method for producing a light emitting diode display, method for producing a division unit for a light emitting diode display, and method for producing a device supply substrate" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,068, issued on June 9, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Method for producing a light emitting diode supply substrate, m... Read More

US Patent Issued to Lightmatter on June 9 for "LED-based photonic communication and processing unit" (Massachusetts Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,069, issued on June 9, was assigned to Lightmatter Inc. (Mountain View, Calif.). "LED-based photonic communication and processing unit" was ... Read More

US Patent Issued to NANYA TECHNOLOGY on June 9 for "Semiconductor structure having conductive pad with protrusion and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,070, issued on June 9, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure having conductive pad with... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,071, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of fabricatin... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,072, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and method of manufacturi... Read More

US Patent Issued to SK hynix on June 9 for "Semiconductor device including two or more semiconductor structures that are stacked one on another and method for fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,073, issued on June 9, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device including two or more semiconductor s... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,074, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Under-bump-metallization structure an... Read More

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