US Patent Issued to SK hynix on June 9 for "Semiconductor device including two or more semiconductor structures that are stacked one on another and method for fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,073, issued on June 9, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Semiconductor device including two or more semiconductor structures that are stacked one on another and method for fabricating the same" was invented by Hee Sun Lee (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first semiconductor structure including a first bonding dielectric layer that is positioned in an uppermost portion of the first semiconductor structure and that includes a first opening; a second semiconductor structure positioned over the first semiconductor structure and including a second bonding d...