US Patent Issued to Intel on June 9 for "Semiconductor package with stacked memory devices" (Malaysian Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,065, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor package with stacked memory devices" was invented by Bok Eng Cheah (Gelugor Pulau Penang, Malaysia), Chia Chuan Wu (Butterworth, Malaysia), Jackson Chung Peng Kong (Tanjung Tokong Pulau Penang, Malaysia) and Kooi Chi Ooi (Gelugor Pulau Pinang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to semiconductor packages, and methods for making them, which includes a package substrate, an interposer with a redistribution layer positioned on the interposer. A recess may be formed in a bottom surface in the interposer and a plu...