US Patent Issued to Tokyo Electron on April 7 for "Method of making 3D memory stacking formation with high circuit density" (Florida, Texas Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,734, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Method of making 3D memory stacking formation with high circuit densi... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES, Changxin Jidian (Beijing) Memory Technologies on April 7 for "Semiconductor structure and manufacturing method thereof" (Chinese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,735, issued on April 7, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China) and Changxin Jidian (Beijing) Memory Technolog... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on April 7 for "Semiconductor structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,736, issued on April 7, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor structure and manufacturing method... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor memory device including lower contact plug protruding from sidewall spacers" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,738, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device including lower ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,739, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Jihoon... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,740, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Dong-W... Read More

US Patent Issued to Arm on April 7 for "Multi-stack bitcell architecture" (French, Indian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,741, issued on April 7, was assigned to Arm Ltd. (Cambridge, Great Britain). "Multi-stack bitcell architecture" was invented by Yannick Mar... Read More

US Patent Issued to Micron Technology on April 7 for "Memory array comprising strings of memory cells and method used in forming a memory array comprising strings of memory cells" (Idaho Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,742, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory array comprising strings of memory cells and method ... Read More

US Patent Issued to Floadia on April 7 for "Memory cell, nonvolatile semiconductor storage device, and method for manufacturing nonvolatile semiconductor storage device" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,743, issued on April 7, was assigned to Floadia Corp. (Tokyo). "Memory cell, nonvolatile semiconductor storage device, and method for manuf... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,744, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and electronic system i... Read More

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