US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Method of depositing atomic layer" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,055, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Method of depositing atomic layer" was ... Read More

US Patent Issued to Centre National de la Recherche Scientifique, Universite de Lille, Centrale Lille Institut, Universite Polytechnique Hauts de France, Universite d'Artois, Nantes Universite on April 14 for "Method for manufacturing a thin-film lithiated material" (French Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,056, issued on April 14, was assigned to Centre National de la Recherche Scientifique (Paris), Universite de Lille (Lille, France), Central... Read More

US Patent Issued to Lam Research on April 14 for "Soaking and ESC clamping sequence for high bow substrates" (Oregon Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,057, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Soaking and ESC clamping sequence for high bow substrates"... Read More

US Patent Issued to Kokusai Electric on April 14 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,058, issued on April 14, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, method of manufacturing semicond... Read More

US Patent Issued to KOKUSAI ELECTRIC on April 14 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,059, issued on April 14, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Substrate processing apparatus, method of manufacturing semicond... Read More

US Patent Issued to CemeCon on April 14 for "Substrate receiving area for process chambers" (German Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,060, issued on April 14, was assigned to CemeCon AG (Wurselen, Germany). "Substrate receiving area for process chambers" was invented by W... Read More

US Patent Issued to HANWHA PRECISION MACHINERY on April 14 for "Thin film deposition apparatus having multi-stage heaters and thin film deposition method using the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,061, issued on April 14, was assigned to HANWHA PRECISION MACHINERY Co. LTD. (Changwon-si, South Korea). "Thin film deposition apparatus h... Read More

US Patent Issued to ASM IP Holding on April 14 for "Multi-port gas injection system and reactor system including same" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,062, issued on April 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Multi-port gas injection system and reactor system in... Read More

US Patent Issued to SAUDI ARABIAN OIL on April 14 for "Landing base external corrosion inhibition using in-situ formed polyacrylamide gel" (Saudi Arabia Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,063, issued on April 14, was assigned to SAUDI ARABIAN OIL COMPANY (Dhahran, Saudi Arabia). "Landing base external corrosion inhibition us... Read More

US Patent Issued to CHEMTREAT on April 14 for "Corrosion control for water systems using passivators and a hydroxycarboxylic acid" (Virginia Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,064, issued on April 14, was assigned to CHEMTREAT INC. (Glen Allen, Va.). "Corrosion control for water systems using passivators and a hy... Read More

• ««
• «
• 36422
• 36423
• 36424
• 36425
• 36426
• 36427
• 36428
• 36429
• 36430
• 36431
• »
• »»