US Patent Issued to EVATEC on April 7 for "Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated" (Liechtensteiner Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,550, issued on April 7, was assigned to EVATEC AG (Trubbach, Switzerland). "Vacuum layer deposition apparatus and method of depositing a la... Read More

US Patent Issued to THE SWATCH GROUP RESEARCH AND DEVELOPMENT on April 7 for "Method for the surface treatment of particles of a metal powder and metal powder particles obtained thereby" (Swiss Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,551, issued on April 7, was assigned to THE SWATCH GROUP RESEARCH AND DEVELOPMENT LTD (Marin, Switzerland). "Method for the surface treatme... Read More

US Patent Issued to Applied Materials on April 7 for "Module for flipping substrates in vacuum" (Indian, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,552, issued on April 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Module for flipping substrates in vacuum" was invent... Read More

US Patent Issued to ANGSTROM ENGINEERING on April 7 for "System and method for controlling film thickness, and film deposition system and method using same" (Canadian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,553, issued on April 7, was assigned to ANGSTROM ENGINEERING INC. (Kitchener, Canada). "System and method for controlling film thickness, a... Read More

US Patent Issued to Korea Institute of Science and Technology on April 7 for "Method for area-selective growth of noble metal thin films using atomic layer deposition" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,554, issued on April 7, was assigned to Korea Institute of Science and Technology (Seoul, South Korea). "Method for area-selective growth o... Read More

US Patent Issued to ASM IP Holding on April 7 for "Toposelective vapor deposition using an inhibitor" (Belgian, Finnish Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,555, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Toposelective vapor deposition using an inhibitor" was ... Read More

US Patent Issued to L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude on April 7 for "Molybdenum imido alkyl/allyl complexes for deposition of molybdenum-containing films" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,556, issued on April 7, was assigned to L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude (Paris). "... Read More

US Patent Issued to ASM IP Holding on April 7 for "Method of forming structure including a doped adhesion film" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,557, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of forming structure including a doped adhesion ... Read More

US Patent Issued to ADVANCED SILICON CARBIDE MATERIALS on April 7 for "Method of making composite articles from silicon carbide" (Pennsylvania, Hawaii, Colorado Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,558, issued on April 7, was assigned to ADVANCED SILICON CARBIDE MATERIALS (Linue, Hawaii). "Method of making composite articles from silic... Read More

US Patent Issued to Tokyo Electron on April 7 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,559, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More

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