ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,859, issued on April 21, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and manufacturing method there... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,860, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Multi-chip stacking method" was invented b... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,861, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-do, South Korea). "Display device and method of manufacturing ... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,862, issued on April 21, was assigned to Rambus Inc. (San Jose, Calif.). "Reliability for DRAM device stack" was invented by Dongyun Lee (... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,863, issued on April 21, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris). "Interactive display devi... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,864, issued on April 21, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Junya Sakai (Tokyo) and... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,865, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and semiconductor pac... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,866, issued on April 21, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan). "Semiconductor device and method... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,867, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Young Min Par... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,868, issued on April 21, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Fan-out stacked semiconductor package s... Read More