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US Patent Issued to Samsung Display on April 21 for "Display device and manufacturing method thereof for reducing pixel defects" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,859, issued on April 21, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and manufacturing method there... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Multi-chip stacking method" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,860, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Multi-chip stacking method" was invented b... Read More


US Patent Issued to SAMSUNG DISPLAY on April 21 for "Display device and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,861, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-do, South Korea). "Display device and method of manufacturing ... Read More


US Patent Issued to Rambus on April 21 for "Reliability for DRAM device stack" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,862, issued on April 21, was assigned to Rambus Inc. (San Jose, Calif.). "Reliability for DRAM device stack" was invented by Dongyun Lee (... Read More


US Patent Issued to Commissariat a l'Energie Atomique et aux Energies Alternatives on April 21 for "Interactive display device and method of manufacturing such a device" (French Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,863, issued on April 21, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris). "Interactive display devi... Read More


US Patent Issued to Mitsubishi Electric on April 21 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,864, issued on April 21, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Junya Sakai (Tokyo) and... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor device and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,865, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and semiconductor pac... Read More


US Patent Issued to National Yang Ming Chiao Tung University on April 21 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,866, issued on April 21, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan). "Semiconductor device and method... Read More


US Patent Issued to SAMSUNG DISPLAY on April 21 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,867, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Young Min Par... Read More


US Patent Issued to SJ Semiconductor(Jiangyin) on April 21 for "Fan-out stacked semiconductor package structure and packaging method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,868, issued on April 21, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Fan-out stacked semiconductor package s... Read More