US Patent Issued to Rambus on April 21 for "Reliability for DRAM device stack" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,862, issued on April 21, was assigned to Rambus Inc. (San Jose, Calif.).

"Reliability for DRAM device stack" was invented by Dongyun Lee (Sunnyvale, Calif.), Carl W. Werner (Los Gatos, Calif.) and Torsten Partsch (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnected stack of Dynamic Random Access Memory (DRAM) die has a base die and DRAM dies. The base die is interconnected vertically with the DRAM dies using through-silicon via (TSV) connections that carry data and control signals throughout the stack. The data signals of the DRAM dies are interconnected vertically to the base die using separate, non-overlapping, sets ...