US Patent Issued to FUJIFILM on July 28 for "Composition for treating semiconductor and method for treating object to be treated" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,702, issued on July 28, was assigned to FUJIFILM Corp. (Tokyo). "Composition for treating semiconductor and method for treating object to b... Read More

US Patent Issued to Applied Materials on July 28 for "Bow mitigation in high aspect ratio oxide and nitride etches" (California Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,703, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Bow mitigation in high aspect ratio oxide and nitrid... Read More

US Patent Issued to NXP USA on July 28 for "Type of bumpless and wireless semiconductor device" (Chinese, Malaysian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,704, issued on July 28, was assigned to NXP USA Inc. (Austin, Texas). "Type of bumpless and wireless semiconductor device" was invented by ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Method of wafer dicing and manufacturing method of semiconductor devices using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,705, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of wafer dicing and manufacturing met... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Semiconductor fabricating system having hybrid brush assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,706, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor fabricating system ha... Read More

US Patent Issued to APPLIED MATERIALS on July 28 for "Batch processing apparatus, systems, and related methods and structures for epitaxial deposition operations" (Indian, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,707, issued on July 28, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.). "Batch processing apparatus, systems, and related met... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Apparatus for processing substrates or wafers" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,708, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Apparatus for processing substr... Read More

US Patent Issued to Tokyo Electron on July 28 for "Substrate processing method, substrate processing apparatus, and computer-readable recording medium" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,709, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method, substrate processing apparatus, and comp... Read More

US Patent Issued to SEMES on July 28 for "Substrate treating apparatus and substrate treating method" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,711, issued on July 28, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Substrate treating apparatus and substrate treati... Read More

US Patent Issued to Kioxia on July 28 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,712, issued on July 28, was assigned to Kioxia Corp. (Tokyo). "Substrate processing apparatus and substrate processing method" was invented... Read More

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