US Patent Issued to NXP USA on July 28 for "Type of bumpless and wireless semiconductor device" (Chinese, Malaysian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,704, issued on July 28, was assigned to NXP USA Inc. (Austin, Texas).

"Type of bumpless and wireless semiconductor device" was invented by You Ge (Tianjin, China), Zhijie Wang (Tianjin, China) and Yit Meng Lee (Kuala Lumpur, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to a first aspect of the present invention there is provided a semiconductor device comprising: a die having a central active region, a top surface, a bottom surface, and sidewalls having a plurality of perforations therein, each perforation extending from a top end at the top surface to a bottom end at the bottom surface; a plurality of die pads on the top surfac...