US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Method of wafer dicing and manufacturing method of semiconductor devices using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,705, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of wafer dicing and manufacturing method of semiconductor devices using the same" was invented by Youngchul Kwon (Suwon-si, South Korea) and Jimin Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of dicing a wafer, the method including preparing a wafer having a plurality of device formation regions and a scribe lane region defining the plurality of device formation regions, forming a plurality of semiconductor devices in the plurality of device formation regions of the wafer, irradiating a first laser b...