US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Interdigital capacitor" (Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,643, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Interdigital capacitor" was invented by Yiqi Tang (Allen, Texas) ... Read More

US Patent Issued to Renesas Electronics on June 16 for "Method of manufacturing semiconductor device and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,644, issued on June 16, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device and semiconductor ... Read More

US Patent Issued to Intel on June 16 for "Molded interconnect memory on package" (Malaysian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,645, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.). "Molded interconnect memory on package" was invented by Hazwani ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,646, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method of... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Edge fill for stacked structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,647, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Edge fill for stacked structure" wa... Read More

US Patent Issued to Intel on June 16 for "Embedded glass cores in package substrates and related methods" (Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,648, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.). "Embedded glass cores in package substrates and related methods"... Read More

US Patent Issued to QUALCOMM on June 16 for "Package comprising a substrate and an interconnection die configured for high density interconnection" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,649, issued on June 16, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a substrate and an interconnection die configured fo... Read More

US Patent Issued to Intel on June 16 for "Package architecture with die-to-die coupling using glass interposer" (Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,650, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architecture with die-to-die coupling using glass inter... Read More

US Patent Issued to Hefei BOE Ruisheng Technology, BOE Technology Group on June 16 for "Wiring substrate and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,651, issued on June 16, was assigned to Hefei BOE Ruisheng Technology Co. Ltd. (Hefei, China) and BOE Technology Group Co. Ltd. (Beijing). ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Package base substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,652, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Package base substrate and semiconductor pac... Read More

• ««
• «
• 167862
• 167863
• 167864
• 167865
• 167866
• 167867
• 167868
• 167869
• 167870
• 167871
• »
• »»